Desktop version

Home arrow Education arrow Fillers for Polymer Applications

Source

Range of Thermal Conductivities

Thermal conductivities of epoxy adhesives can be grouped into five general segments:

  • 1. Very high: >4.0 W/(m K) (new technologies)
  • 2. High: >2.0 W/(m K) (typically filled with silver)
  • 3. Ordinary: 0.7-2.0 W/(m K) (aluminum and boron nitride filled)
  • 4. Low: <0.7 W/(m K) (no functional additives mentioned)
  • 5. Epoxy resin: 0.2-0.35 W/(mK)

A comparison of different thermal conductive adhesives is given in Table 7.

References

Heinle C (2012) Simulationsgesttitzte Entwicklung von Bauteilen aus warmeleitenden Kunststoffen. Thesis Technischen Fakultat der Universitat Erlangen-Nurnberg

HPF The Mineral Engineers (2014a) Alumosilicate* - Mineralische Fullstoffe far warmeleitfahige Compounds; Seminar: Warmeleitende Kunststoffe - wie soll das gehen?*. Kunststoff Institut, Laudenscheid

HPF The Mineral Engineers (2014b) Alumosilicate* for improvement of the thermal conductivity of plastics. Technical information 8206

Zilles JU (2014) Adding heat management capabilities to thermoplastics and thermosets. In: LPS 2014 LED professional symposium, conference proceedings, Bregenz, 30 Sept-2 Oct 2014

 
Source
Found a mistake? Please highlight the word and press Shift + Enter  
< Prev   CONTENTS   Next >

Related topics